Microsoft has joined forces with Micron, Samsung, Altera, IBM, Open-Silicon and Xilinx in Hybrid Memory Cube Consortium, an organization aimed at uniting the computer industry around a common standard for the memory type of the same name.
HMC Technology Represents a major step forward in the direction of Increasing memory bandwidth and performance, while Decreasing the energy and latency Needed for moving data between the memory arrays and the processor cores.
Hybrid Memory Cube is a new type of memory that is expected to account for the next great epochal in the memory industry. The whole thing is to stack the chips on each other, which is said to provide up to 20 times the performance with only a tenth of the energy consumption of today's DRAM.
The developers sketch now in the draft a standardized interface for HMC-memories, as the organization's members to consider. Thereafter, the industry giants agree on a final specification, due out later in the year.
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